i) High-reflection DBR Multi-layers

• High-reflection DBR mirror (Rl>97% for blue light)
• Optimized electrode layout for active area usage
• High-reflection contact

ii) Highy-reflection N-Electrode

• Highy-reflection N-Electrode (Rl>90% for blue light)
• Special design for N current spreading
• High-reflection contact layer

iii) Chip reliability

• High stability dielectric film design
• Solution and process control for reliability and IR
• Qualified and passed Higth-T and Thermal Shock Test